In order to combine Conduction heat function of BT ViaFillingPlating and the insulation and heat resistance characteristics of BT, We developed the direct plating BT substrate process DPC based on the innovative concept of semiconductor thin film.
This process uses ViaFillingPlating and exposure development of the bt substrate circuit diagram printed on the circuit board, The line is also not easy to fall off, and the line location can be more accurate to reduce the advantages of the small coefficient of thermal expansion coupled with the ViaFillingPlating cooling comparable ALN properties.
high-brightness high-power LED flip-chip,
Microwave wireless communications
semiconductor equipment and other fields.