Semiconductor material development and marketing

Different semiconductor devices have different morphological requirements for semiconductor materials, including single crystal slicing, grinding, polishing, filming and the like. Different forms of s

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About Central Material

In recent years, semiconductor industry has been growing steadily and significantly. Central Material co. has established in 2014 in Taoyuan, Taiwan. In order to satisfied diversity demand for professional electronic materials and provide a perfect technical support, we actively exploring overseas markets, and developing trade mark for all kinds of needs and products. So far, Central Material is the exclusive agent of many well-known international manufacturers in Taiwan.

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Silicon Wafer
Bt ViaFillingPlating Substrate
By CM design
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SGS RoH S Test Report 2016/10
In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor material, such as a silicon crystal, used in the fabrication of integrated circuits and other microdevices. The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged. Several types of solar cell are also made from such wafers. On a solar wafer a solar cell (usually square) is made from the entire wafer. Wafers are formed of highly pure (99.9999999% purity) nearly defect-free single crystal material. One process for forming crystalline wafers is known as Czochralski growth invented by the Polish chemist Jan Czochralski. In this process, a cylindrical ingot of high purity monocrystalline semiconductor, such as silicon or germanium, is formed by pulling a seed crystal from a 'melt'. Donor impurity atoms, such as boron or phosphorus in the case of silicon, can be added to the molten intrinsic material in precise amounts in order to dope the crystal, thus changing it into n-type or p-type extrinsic semiconductor. The ingot is then sliced with a wafer saw (wire saw) and polished to form wafers.